| Sn-0.3Ag-0.7Cu-xBi低银无铅钎料的润湿性 |
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| 引用本文： | 胡文刚,孙凤莲,王丽凤,马鑫.Sn-0.3Ag-0.7Cu-xBi低银无铅钎料的润湿性[J].电子元件与材料,2008,27(4):38-41. |
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| 作者姓名： | 胡文刚 孙凤莲 王丽凤 马鑫 |
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| 作者单位： | 1. 哈尔滨理工大学,材料科学与工程学院,黑龙江,哈尔滨,150040
2. 亿铖达工业有限公司,广东,深圳,518101 |
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| 基金项目： | 国家自然科学基金
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黑龙江省研究生创新科研项目 |
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| 摘 要： | 以Bi为添加剂对低银型Sn-0.3Ag-0.7Cu无铅钎料进行改性,应用SAT—5100型润湿平衡仪对Sn-0.3Ag-0.7Cu-xBi(x=0,1,3和4.5)钎料的润湿性能作了对比分析。结果表明:适量Bi元素的加入可以改善Sn-0.3Ag-0.7Cu钎料合金的润湿性能,且在240℃下Sn-0.3Ag-0.7Cu-3.0Bi无铅钎料具有最佳的润湿性能,在250℃其润湿力达到最大值3.2×10–3N/cm。
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| 关 键 词： | 金属材料 无铅钎料 润湿性 润湿力 铋 |
| 文章编号： | 1001-2028(2008)04-0038-04 |
| 修稿时间： | 2007年12月29 |
Wettability of Sn-0.3Ag-0.7Cu-xBi low Ag lead-free solder |
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| HU Wen-gang,SUN Feng-lian,WANG Li-feng,MA Xin.Wettability of Sn-0.3Ag-0.7Cu-xBi low Ag lead-free solder[J].Electronic Components & Materials,2008,27(4):38-41. |
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| Authors: | HU Wen-gang SUN Feng-lian WANG Li-feng MA Xin |
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| Affiliation: | HU Wen-gang1,SUN Feng-lian1,WANG Li-feng1,MA Xin2 (1. College of Material Science & Engineering,Harbin Univ Sci Tech,Harbin 150040,China,2. Yik Shing Tat Industrial Co.,Ltd,Shenzhen 518101,Guangdong Province,China) |
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| Abstract: | The influences of Bi on wettability of Sn-0.3Ag-0.7Cu lead-free solder alloy were studied. The contrastive experiments and analyses on the wettability of Sn-0.3Ag-0.7Cu-xBi (x = 0,1,3 and 4.5) solders were done by wetting balance equipment. Results show that the addition of Bi can improve the wettability of Sn-0.3Ag-0.7Cu lead-free solder alloy. Sn-0.3Ag-0.7Cu-3.0Bi lead-free solder has a favorable wettability at 240 ℃. The wettability of Sn-0.3Ag-0.7Cu lead-free solder alloy can be increased as the temperature rising. The wetting force of Sn-0.3Ag-0.7Cu lead-free solder alloy reaches to the maximum 3.2×10–3 N/cm at 250 ℃. |
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| Keywords: | metallic material lead-free solder wettability wetting force Bi |
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