| 背钻工艺综述 |
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| 引用本文： | 刘新年,刁生祥.背钻工艺综述[J].印制电路信息,2014(11):15-16,47. |
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| 作者姓名： | 刘新年 刁生祥 |
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| 作者单位： | 深圳市景旺电子股份有限公司,广东 深圳,215300 |
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| 摘 要： | 背钻作为一种提高信号传输速度及质量,在PCB设计中广泛应用。文章介绍背钻原理及孔内多余铜柱对信号影响,通过试验验证来确定背钻流程设计及深度设定方法的管控的可行性。
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| 关 键 词： | 背钻 铜柱 信号损耗 信号 |
Back drilling technology review |
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| LIU Xin-nian
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DIAO Sheng-xiang.Back drilling technology review[J].Printed Circuit Information,2014(11):15-16,47. |
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| Authors: | LIU Xin-nian DIAO Sheng-xiang |
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| Affiliation: | LIU Xin-nian, DIAO Sheng-xiang |
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| Abstract: | Back drill, as a kind of signal transmission with speed and quality, is widely used in PCB design. This paper introduces the principle and back drill hole excess copper column effect on signal, through the test to determine the back drill process design and the feasibility of the control of depth setting method. |
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| Keywords: | Back to Drill The Pillars Signal Loss |
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