High-aspect-ratio, molded microstructures with electrical isolation and embedded interconnects |
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Authors: | L. Muller R. T. Howe A. P. Pisano |
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Affiliation: | (1) Berkeley Sensor and Actuator Center, 497 Cory Hall, University of California, Berkeley, CA 94720, US |
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Abstract: | A thin film molding process was developed to enable the fabrication of monolithic micromechanical structures with built-in electrical isolation and embedded interconnects. High-aspect-ratio composite structures were created from undoped polysilicon, low stress nitride and doped polysilicon, in a dual micromolding process. These monolithic electro-mechanical microstructures are more resistant to thermal effects and misalignment errors compared to microsystems assembled from discrete elements. In addition, the microstructures are molded in a re-usable mold providing an economical advantage. A gimballed electrostatic microactuator was successfully fabricated using this process. Electrical isolation was achieved with a combination of low stress nitride and undoped polycrystalline silicon. Various isolation geometries were investigated. Current leakages of less than 1 nA at 30 V were measured for isolation structures 40 μm long and 80 μm tall. Received: 13 November 2000/Accepted: 16 November 2000 |
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