微机电系统静动态测试技术研究

在中国国家863高技术发展计划MEMS重大专项课题《MEMS动态特性频闪干涉视觉三维测量技术及系统》资助下，研发微机电系统(Micro Electro Mechanical System , MEMS)动态特性三维测量技术与系统。对已有的微几何量、微材料力学性能和MEMS动态参数测试方法进行研讨。 几何尺寸和表面形貌轮廓的测量是MEMS测量的基础。二维微几何量检测采用普通光学显微镜和扫描电子显微镜。表面形貌测量大致可分为接触式测量和非接触式测量，机械触针式轮廓仪是典型的接触式测量仪器，非接触式测量大多采用光学技术，主要有光针式轮廓仪，采用光切、干涉、投影光栅和微视觉等测量方法。

Study on Static and Dynamic Measurement Technology for MEMS

This research, funded by MEMS key project “Stroboscopic Interferometry Vision Measurement Technology and System for MEMS 3D Dynamic Characterization” from 863 Hi tech Research and Development Program of China, focuses on the research and development of measuring technology and system for Micro Electro Mechanical System (MEMS) 3D dynamic characterization. This paper discusses the existing static and dynamic measurement methods for micro geometric characteristics, mechanical properties of micro materials, and MEMS dynamic parameters. The measuring of geometric dimension and surface profile is the basis for MEMS measurement. Common optical microscope and scanning electron microscope (SEM) are used for testing 2D micro geometric characteristics. Measuring technologies for surface profile falls roughly into two categories, contactile and non contactile. Mechanical stylus profilometer is a typical contactile measuring equipment. Non contactile measurement methods, which mainly adopt optical technologies, include optical stylus profilometer, light sectioning, interferometry, projected grating and microvision etc.