| 导电胶的研究新进展 |
| |
| 引用本文： | 王飞,黄英,侯安文.导电胶的研究新进展[J].中国胶粘剂,2009,18(10). |
| |
| 作者姓名： | 王飞 黄英 侯安文 |
| |
| 作者单位： | 西北工业大学理学院应用化学系,陕西,西安,710072 |
| |
| 摘 要： | 介绍了近年来发展迅速的几种典型的导电胶(如纳米导电胶、复合导电胶、紫外光固化导电胶和无导电粒子导电胶等),阐述了导电胶可靠性研究中环境影响试验的研究现状,展望了今后导电胶的应用前景和发展方向。
|
| 关 键 词： | 导电胶 电子产品 可靠性 失效机理 |
Research new progress of conductive adhesive |
| |
| WANG Fei,HUANG Ying,HOU An-wen.Research new progress of conductive adhesive[J].China Adhesives,2009,18(10). |
| |
| Authors: | WANG Fei HUANG Ying HOU An-wen |
| |
| Abstract: | Several typical conductive adhesives which were rapidly developed in recent years were intro duced(such as nano-conductive adhesive,composite conductive adhesive,UV-curing conductive adhesive and conductive adhesive without conductive particles). The research actuality of environmental impact test were described in reliability research of conductive adhesive. The future application prospects and development direction were expected for conductive adhesive. |
| |
| Keywords: | conductive adhesive electronic products reliability failure mechanism |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
