Cu/Mo/Cu复合板界面变形及厚度配比

采用热轧+温轧方法制备Cu/Mo/Cu复合板，研究轧制工艺对复合板结合界面及组元厚度配比的影响。结果表明：经过轧制变形后，铜钼界面实现紧密结合且结合机制为齿状啮合，铜层外表面和靠近界面层的晶粒比中部细小；随着变形量的增加，铜层等轴状晶粒沿轧制方向被拉伸，界面结合效果明显改善，且由齿状变得较为平直。分析组元厚度配比，铜层变形量较钼层的大，随着总压下量的增加，组元压下率的差值减小，变形量逐渐趋于一致；首次提出了Cu/Mo/Cu三层复合板厚度配比的关系，为实际选择原料提供依据

Interface Deformation and Rolling Thickness-Ratio of Cu/Mo/Cu Composite Plates

Effects of rolling process on bonding interface and the element thickness-ratio of Cu/Mo/Cu cladding plates prepared by hot rolling and warm rolling were studied. The results show that the Cu/Mo interface is closely bonded after rolling deformation and the bonding mechanism of Cu/Mo is dentate meshing. The grain of Cu layer near the surface and the interface is smaller than that in the center. With the increase of the deformation, the equiaxed grains of Cu layer are stretched along the rolling direction. The bonded effect of the interface is significantly improved and becomes straighter from the dentition. The deformation of Cu layer is larger than that of Mo layer. The thickness-ratio was analyzed. With the increase of the total reduction, the difference of the element deformation decreases and the element deformation gradually tends to conform. The thickness-ratio of Cu/Mo/Cu composites relation is proposed and it offers a method for base material choice