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电磁感应加热技术在包装工程中的应用
引用本文:杜锦才,王晓平. 电磁感应加热技术在包装工程中的应用[J]. 包装工程, 2005, 26(5): 21-23
作者姓名:杜锦才  王晓平
作者单位:浙江大学,杭州,310027;浙江广厦建设职业技术学院,东阳322100
摘    要:
阐述包装工程中电磁感应加热技术应用现状,介绍感应加热技术的原理和特点.结合实际工程情况,说明感应加热技术在包装工程中所具有的适用性和广泛性以及在某些特定场合的优越性.

关 键 词:包装工程  电磁感应加热  高频/超音频
文章编号:1001-3563(2005)05-0021-03
收稿时间:2005-05-30
修稿时间:2005-05-30

Applications of electromagnetic induction heating technology in packaging engineering
DU Jin-cai,WANG Xiao-ping. Applications of electromagnetic induction heating technology in packaging engineering[J]. Packaging Engineering, 2005, 26(5): 21-23
Authors:DU Jin-cai  WANG Xiao-ping
Affiliation:1. Zhejiang University, Hangzhou 310027, China; 2. Guangsha college of applied construction technology, Dongyang 322100, China
Abstract:
This paper expatiates on the status quo of the applications of electromagnetic induction heating technology in packaging engineering, and introduces the principle and characteristics of the applications of electromagnetic induction heating technology. It was indicated through linking practical projects that the applications of electromagnetic induction heating technology have more applicability and superiority in packaging engineering.
Keywords:packaging engineering   electromagnetic induction heating   high frequency/supersound frequency
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