金属粉末-聚合物复合导电胶研究进展

随着电子封装工艺的发展，越来越多的人们致力于研发更高性能、环境友好的新连接材料，以聚合物为基体的复合导电胶在电子封装领域的应用也由此越来越广泛。文章介绍了导电胶的分类和组成，以及改善导电胶性能的方法与技术，从宏观和微观角度对导电机理进行了探讨并对研究前景做了展望。

Progress in Research on Metal Fillers-Polymer Composite Electrically Conductive Adhesives

New interconnect materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. Polymer-based conductive adhesive materials have become widely used in many electronic packaging interconnect application. In this paper, the composition and the type of electrically conductive adhesives are introduced. Some studies on how to improve the properties of electrically conductive adhesives are also summarized. Some mechanisms are briefly summarized from the points of macroscopic and microcosmic view, as well as the prospect of the research direction.