高压倒装LED照明组件的热性能

高压(HX)倒装LED是一种新型的光源器件,在小尺寸、高功率密度发光光源领域有广泛的应用前景.设计了4种不同工作电压的高压倒装LED芯片,进行了流片验证,并对其进行了免封装芯片(PFC)结构的封装实验,在其基础上研制出一种基于高压倒装芯片的PFC-LED照明组件.建立了9V高压倒装LED芯片、PFC封装器件及照明组件的模型,利用流体力学分析软件进行了热学模拟和优化设计;利用T3Ster热阻测试分析仪进行了热阻测试,验证了设计的可行性.结果表明,基于9V高压倒装LED芯片的PFC封装器件的热阻约为0.342 K/W,远小于普通正装LED器件的热阻.实验结果为基于高压倒装LED芯片的封装及应用提供了热学设计依据.

Thermal Performances of a Light Engine Based on High Voltage Flip-Chip LEDs

High voltage (HV) flip-chip LED is a new type of light source devices and has wide application prospect in the field of small size and high power density light sources.Four kinds of HV flipchip LEDs with different working voltages were designed,and then they were implemented.The packaging experiment of the package free chip (PFC) structure was carried out,and a PFC-LED light engine based on the HV flip-chip was developed.The 9 V HV flip-chip LEDs,PFC package devices and light engine models were built up.The thermal simulation and optimization design were carried out with the hydromechanics analysis software.The thermal resistance was tested by the T3Ster thermal resistance measurement analyzer and the feasibility of the design was verified.The results show that the thermal resistance of PFC package devices based on the 9 V HV flip-chip LED is about 0.342 K/W,which is less than that of the ordinary LED device.The experimental results provide a thermal design basis for the packaging and application of the high voltage flip-chip LED.