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| 非甲醛化学镀铜研究进展 | |
| 引用本文： | 高四,刘荣胜. 非甲醛化学镀铜研究进展[J]. 电镀与涂饰, 2010, 29(3): 26-29 |
| 作者姓名： | 高四 刘荣胜 |
| 作者单位： | 中南电子化学材料所,湖北,武汉,430070;中南电子化学材料所,湖北,武汉,430070 |
| 摘 要： | 化学镀铜在PCB生产中应用广泛,但常用的还原剂甲醛对人体和环境有害。本文综述了化学镀铜中替代甲醛的环保型还原剂的研究进展,介绍了以醛糖类、含硼化合物、低价金属盐、次磷酸盐作还原剂的化学镀铜研究现状及进展。 |
| 关 键 词： | 化学镀铜 非甲醛还原剂 印制电路板 环保 |
Research progress of non-formaldehyde electroless copper plating |
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| GAO Si,LIU Rong-sheng. Research progress of non-formaldehyde electroless copper plating[J]. Electroplating & Finishing, 2010, 29(3): 26-29 | |
| Authors: | GAO Si LIU Rong-sheng |
| Abstract: | Electroless copper plating is widely used in PCB manufacturing, but the commonly-used reducing agent formaldehyde is harmful to people and environment. The research progress of the environmentally friendly reducing agents as alternatives to formaldehyde for electroless copper plating, such as aldoses, boron containing compounds, protosalts, and hypophosphite, were introduced in details. |
| Keywords: | electroless copper plating non-formaldehyde reducing agent printed circuit board environmental protection |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |