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| Bi对Sn-0.7Cu无铅焊料微观组织和性能的影响 | |
| 引用本文： | 李建新,赵国平,程晓农. Bi对Sn-0.7Cu无铅焊料微观组织和性能的影响[J]. 材料导报, 2009, 23(Z1) |
| 作者姓名： | 李建新 赵国平 程晓农 |
| 作者单位： | 江苏大学材料科学与工程学院,镇江,212013 |
| 摘 要： | 研究了Bi对Sn-0.7Cu焊料合金的微观组织、物理性能、润湿性能以及力学性能的影响.结果表明,在Sn-0.7Cu焊料合金中添加适量Bi后,合金的微观组织和性能有较明显的变化,Bi的加入能够降低焊料合金的熔点,提高润湿性能,同时对合金的力学性能也有很大影响,Bi能显著提高合金的抗拉强度,但合金的塑性会有所降低. |
| 关 键 词： | 无铅焊料 |
Effect of Bi on Microstructures and Properties of Sn-0.7Cu Lead-free Solder |
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| LI Jianxin,ZHAO Guoping,CHENG Xiaonong. Effect of Bi on Microstructures and Properties of Sn-0.7Cu Lead-free Solder[J]. Materials Review, 2009, 23(Z1) | |
| Authors: | LI Jianxin ZHAO Guoping CHENG Xiaonong |
| Abstract: | The effect of Bi on the microstructures,physical properties,wettability and mechanical properties of Sn0.7Cu lead-free solder are investigated.The results show that the addition of Bi leads to obvious changes in microstructures and properties,the addition of Bi can lower the melting point of solder alloy,improve the wetting properties,at the same time,the mechanical properties of the alloy also influenced greatly.Bi elements can significantly increase the tensile strength of the alloy,but the plasticity will be lower. |
| Keywords: | Sn-0.7Cu Bi lead-free solder Sn-0.7Cu Bi |
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