第七届电子封装技术国际会议(通知)

自1994年以来,两年一届的电了封装技术国际会议(ICEPT)分别在中国北京、上海和深圳等地顺利召 开。作为唯一同中国政府,权威机构,业内主导所组织和支持的电子封装技术会议,每届都吸引了大批的国内 外高校、研究机构、封装组装制造厂商、封装测试组装设备厂商、封装组装材料厂商踊跃参加,人数每次都超 过400位,包括来自近20个国家和地区的国外专家、学者和企业家等。会议议题主要集中在封装设计、封装 制造、封装测试、以及光电了封装、MEMS封装、系统及组装等领域。这是唯一由中国政府和相关业界发起 的国内最高水平、最大规模的关于电…

7^th International Conference on Electronics Packaging Technology

Since 1994, ICEPT has been held in Beijing, Shanghai, and Shenzhen, China, every two years respectively. As the only international electronics packaging technology conference organized and supported by Chinese government and relevant authorities, leading industries and academia, ICEPT has attracted many participants from the whole world, covering all the relevant fields of electronic packaging, such as equipments, ICs, packaging, interconnect, Sensor/actuator/MEMS/NEMS, Optoelectronics, LEDs, LCDs, substrates, systems, PCBs and assembly.