Analysis of thermomechanical interactions in a miniature solder system under cyclic fatigue loading |
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Authors: | Bor Zen Hong |
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Affiliation: | (1) IBM Microelectronics Division, Z/81A, 1580 Route 52, Hopewell Junction, 12533 New York |
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Abstract: | This paper discusses the possible thermomechanical interaction (coupling) phenomena of a miniature solder system in electronic
packaging application similar to those which have been identified for some metallic material systems in aerospace and nuclear
structures under cyclic fatigue loads at different frequencies. The main objective is to investigate the heat generated by
the viscoplastic deformations, and vice versa, especially on the thermal transient and the gradient induced viscoplastic ratchetting
response of cyclic creep. A literature review was conducted to focus on the temperature-dependent, strain rate-sensitive stress-strain
response of the eutectic or near-eutectic lead-tin (Pb37-Sn63 or Pb40-Sn60) solder alloys. The result was used to develop
and apply a simple overstress constitutive theory for modeling the coupled, isotropic thermoviscoplasticity of the eutectic
lead-tin solder alloy. A fully coupled heat transfer and mechanical finite element model is used to simulate possible thermal-mechanical
interactions of temperature rise and viscoplastic ratchetting of the miniature solder systems in a C4/BGA chip scale package
(CSP) under cyclic fatigue loads at different frequencies. The results of analysis are discussed to compare between a coupled
thermomechanical model and that of a pure mechanical model. |
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Keywords: | Thermomechanical miniature coupling solder system chip scale package viscoplasticity |
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