| 高密度封装技术推动测试技术发展 |
| |
| 引用本文： | 鲜飞.高密度封装技术推动测试技术发展[J].印制电路信息,2004(9):64-66. |
| |
| 作者姓名： | 鲜飞 |
| |
| 作者单位： | 烽火通信科技股份有限公司,430074 |
| |
| 摘 要： | 高密度封装技术的飞速发展也给测试技术提出了新挑战。为了应对挑战,新的测试技术不断涌现。本文主要介绍了几种新型测试技术的特点,并对未来测试技术的发展趋势及方向进行了初步分析。
|
| 关 键 词： | 集成电路 封装 测试技术 自动光学检测技术 自动X-射线检测 |
HDI Packaging Technology Push Testing Technology Development |
| |
| Xian Fei.HDI Packaging Technology Push Testing Technology Development[J].Printed Circuit Information,2004(9):64-66. |
| |
| Authors: | Xian Fei |
| |
| Abstract: | The rapid development of high density packaging technology has already bring up the new challenge to testing technology. For replying challenge, the new testing technology continuously appears. Characteristics of several advanced testing technology are introduced in the paper. The up-to-date trends are discussed and the future research directions are suggested. |
| |
| Keywords: | IC package testing technology AOI AXI |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
