焊球阵列转变与绝缘基板技术

在半导体整体的焊球阵列封装(BGA)领域,一份针对数个关键封装形式所进行的分析报告中,显示了造成不同焊球阵列封装形式成长或下跌的原因,并更清楚地点出了目前使用的数种基板技术的缺点。这篇分析报告列出了主要的焊球阵列封装的形式和基板发展潮流,还清楚地指出焊球阵列封装整体的发展延缓了硅芯片技术的演进,这在某些BGA领域中尤其明显,主要是因为缺乏先进的基板技术。因此文后得出结论,封装产业供货供应链基板市场中可能出现新的厂商,其也许来自主机板市场。

BGA Transform and Insulating Substrate Technology

Within the overall ball-grid-array package ( BGA ) sector of the semiconductor industry, an analysis of selected key package types reveals the reasons behind the growth or decline of the various BGA package types and, more specifically, gives a clear view into some of the shortcomings of the underlying substrate technologies. The analysis here outlines the major BGA package types and substrate trends. This analysis clearly shows the reader that the viability of BGA packaging overall is increasingly trailing silicon wafer technology progression; this is happening in some BGA sub-sectors faster than others because of lagging substrate technology. The conclusion is that there is an opportunity within the packaging supplier community for new players in the substrate market, perhaps emerging from the motherboard industry.