| 功率放大器的热设计研究 |
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| 引用本文： | 胡广华,钱兴成,汪宇.功率放大器的热设计研究[J].电子与封装,2012(7):18-20. |
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| 作者姓名： | 胡广华 钱兴成 汪宇 |
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| 作者单位： | 南京电子器件研究所,南京210016 |
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| 摘 要： | 功率放大器作为发射通道分系统的核心部件,对其性能指标、可靠性提出了较高要求。针对电子设备的高性能、高可靠性要求,文章主要研究了固态脉冲功率放大器的热设计。以Ku波段功率放大器为例,介绍Ku波段功率放大器的热设计方法和流程,采用有限元软件ANSYS建立其三维热模型,对模型在空气自然对流情况下的温度分布状况进行了模拟和分析,模拟结果与实测值基本吻合,验证了模型的有效性。研究结果为功率放大器的热设计提供了重要的理论依据。
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| 关 键 词： | 可靠性 结温 热阻 |
Thermal Design of Power Amplifier |
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| HU Guang-hua,QIAN Xing-cheng,WANG Yu.Thermal Design of Power Amplifier[J].Electronics & Packaging,2012(7):18-20. |
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| Authors: | HU Guang-hua QIAN Xing-cheng WANG Yu |
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| Affiliation: | ( Nanjng Electronic Devices Institute, Nanjing 210016, China) |
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| Abstract: | As the core of transmit channels, tasks have put forward high requirements of function and performance. Considering the demands of power amplifiers for high reliability, this paper gives thermal design of solid state pulse power amplifier. As an example, we introduce the thermal design of Ku-band power amplifier. A three dimensional thermal model of power amplifier was built with ANSYS to calculate the temperature distribution under air free convection condition. Good agreement between simulation and experiment and which demonstrated the effectiveness of the thermal model. The simulated results provide a theoretical basis for thermal design of power amplifiers. |
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| Keywords: | reliability channel temperature thermal resistance |
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