| Ag,Al,Ga对Sn-9Zn无铅钎料润湿性能的影响 |
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| 引用本文： | 王慧,薛松柏,陈文学,王俭辛.Ag,Al,Ga对Sn-9Zn无铅钎料润湿性能的影响[J].焊接学报,2007,28(8):33-36,44. |
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| 作者姓名： | 王慧 薛松柏 陈文学 王俭辛 |
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| 作者单位： | 南京航空航天大学,材料科学与技术学院,南京,210016 |
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| 基金项目： | 江苏省六大人才高峰基金 |
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| 摘 要： | 采用润湿平衡法测试了Sn-9Zn-X(X为Ag,Al,Ga)无铅钎料分别配合ZnCl2-NH4Cl钎剂和免清洗助焊剂,在空气和氮气保护的两种条件下的润湿性能,分析研究了合金元素Ag,Al,Ga的添加量对Sn-9Zn-X无铅钎料润湿性的影响规律.结果表明,合金元素Ag,Al,Ga在Sn-9Zn中的最佳添加量(质量分数)分别为0.3%,0.005%～0.02%,0.5%.采用氮气保护可以显著改善Sn-9Zn-X无铅钎料的润湿性,而Sn-9Zn-X无铅钎料配合ZnCl2-NH4Cl钎剂时具有较好的润湿性,甚至优于Sn-3.5Ag-0.5Cu在相同条件下的润湿性.这一研究结果表明,通过研发适合于Sn-Zn系无铅钎料的高性能助焊剂,从而改善Sn-Zn系钎料的润湿性能是完全可行的.
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| 关 键 词： | 无铅钎料 Sn-Zn 合金元素 润湿性 |
| 文章编号： | 0253-360X（2007）08-033-05 |
| 收稿时间： | 2007/4/29 0:00:00 |
| 修稿时间： | 2007-04-29 |
Effect of Ag, Al, Ga addition on wettability of Sn-9 Zn lead-free solder |
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| WANG Hui,XUE Songbai,CHEN Wenxue and WANG Jianxin.Effect of Ag, Al, Ga addition on wettability of Sn-9 Zn lead-free solder[J].Transactions of The China Welding Institution,2007,28(8):33-36,44. |
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| Authors: | WANG Hui XUE Songbai CHEN Wenxue and WANG Jianxin |
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| Affiliation: | College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China and College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China |
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| Abstract: | Wettability of Sn-9Zn-X (Ag, Al, Ga)leadfree solder, with non-cleaning flux and ZnCl2-NH4Cl flux, was appraised by means of wetting balance method in air and N2 atmospheres; the effect of different additive amount of Ag, Al, Ga on the wettability of Sn-9Zn-X solders was studied.The results indicate that the optimum additive amount of Ag, Al, Ga in Sn-9Zn solder is 0.3, 0.005-0.02 and 0.5 mass percent, respectively.Thewet-tability of Sn-9Zn-X can be obviously improved in N2 atmospheres.It is also found that Sn-9Zn-X lead-free solders show preferable wettability with ZnCl2-NH4Cl flux, even better than that of Sn-3.5Ag-0.5Cu solder under the same condition, which may reveal the feasibility of improving the wettability of Sn-Zn series lead-free solders by developing suitable flux. |
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| Keywords: | lead-free solder Sn-Zn solder alloy element wettability |
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