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Thermal conductivity,heat capacity,and thermal diffusivity of selected commercial AlN substrates
Authors:R. B. Dinwiddie  A. J. Whittaker  D. G. Onn
Affiliation:(1) Department of Physics and Astronomy, University of Delaware, 19716 Newark, Delaware, USA
Abstract:
The thermal transport properties of four commercially available AlN substrates have been investigated using a combination of steady-state and transient techniques. Measurements of thermal conductivity using a guarded longitudinal heat flow apparatus are in good agreement with published room temperature data (in the range 130–170 W · m–1 · K–1). Laser flash diffusivity measurements combined with heat capacity data yielded anomalously low results. This was determined to be an experimental effect for which a method of correction is presented. Low-temperature measurements of thermal conductivity and heat capacity are used to probe the mechanisms that limit the thermal conductivity in AlN.Paper presented at the Tenth Symposium on Thermophysical Properties, June 20–23, 1988, Gaithersburg, Maryland, U.S.A.
Keywords:aluminum nitride  heat capacity  substrate  thermal conductivity  thermal diffusivity
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