| 低锡铜-锡合金无氰电镀工艺 |
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| 引用本文： | 张琪,曾振欧,徐金来,赵国鹏.低锡铜-锡合金无氰电镀工艺[J].电镀与涂饰,2011,30(9):1-4. |
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| 作者姓名： | 张琪 曾振欧 徐金来 赵国鹏 |
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| 作者单位： | 1. 华南理工大学化学与化工学院,广东广州,510640
2. 广州市二轻工业科学技术研究所,广东广州,510170 |
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| 摘 要： | 通过赫尔槽试验研究了镀液组成、pH和温度对低锡铜-锡合金镀层外观的影响,并用方槽电镀试验研究了时间和电流密度对低锡铜-锡合金镀层的厚度与组成的影响,得到最佳镀液配方与工艺条件为:Cu2P2O7·3H2O 25 g/L,Sn2P2O7 1.0 g/L,K4P2O7·3H2O 250 g/L,K2HPO4·3H2O 60 ...
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| 关 键 词： | 铜-锡合金镀层 无氰电镀 焦磷酸盐 赫尔槽试验 |
Process of cyanide-free low-tin copper-tin alloy electroplating |
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| ZHANG Qi,ZENG Zhen-ou,XU Jin-lai,ZHAO Guo-peng.Process of cyanide-free low-tin copper-tin alloy electroplating[J].Electroplating & Finishing,2011,30(9):1-4. |
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| Authors: | ZHANG Qi ZENG Zhen-ou XU Jin-lai ZHAO Guo-peng |
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| Affiliation: | ZHANG Qi,ZENG Zhen-ou*,XU Jin-lai,ZHAO Guo-peng School of Chemistry and Chemical Engineering,South China University of Technology,Guangzhou 510640,China |
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| Abstract: | The effects of bath composition,pH and temperature on the appearance of low-tin Cu-Sn alloy coating were studied by Hull cell test.The effects of deposition time and current density on the thickness and composition of coating were also studied by square cell plating test.The optimal bath composition and process parameters are as follows:Cu2P2O7.3H2O 25 g/L,Sn2P2O7 1.0 g/L,K4P2O7.3H2O 250 g/L,K2HPO4.3H2O 60 g/L,temperature 25 °C,pH 8.5,current density 1.0 A/dm2,time 20 min,and aeration/agitation.Under the given process conditions,the Cu-Sn alloy coating obtained is golden,bright and uniform,containing copper 85wt%-95wt% and having the advantages of high tarnish resistance and good adhesion to substrate. |
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| Keywords: | copper-tin alloy coating cyanide-free electroplating pyrophosphate Hull cell test |
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