| 工艺条件对电沉积CoPtW合金成分的影响 |
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| 引用本文： | 崔玉建,葛洪良,黄丽红,周红,韩雁冰,刘亚丕.工艺条件对电沉积CoPtW合金成分的影响[J].稀有金属,2004,28(1):268-270. |
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| 作者姓名： | 崔玉建 葛洪良 黄丽红 周红 韩雁冰 刘亚丕 |
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| 作者单位： | 中国计量学院应用物理系,浙江,杭州,310018 |
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| 基金项目： | 浙江省自然科学基金资助项目 ( 5 0 2 12 2 )，浙江省科技人才培养项目 (RC0 10 5 6) |
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| 摘 要： | 报道了以钨酸钠、硫酸钴和二亚硝酸二胺铂为主盐、以柠檬酸盐为络合剂电沉积钴铂钨合金的工艺过程。研究了镀液中钨盐浓度、络合剂浓度、电流密度、镀液温度等沉积条件对钴铂钨合金成份的影响。结果表明，在实验条件下，镀液中钨盐含量的增加、电流密度的增大和镀液温度的升高都会引起合金镀层中的钨含量增大。络合剂用量的增加使合金镀层中的钨含量下降，而使钴和铂的含量增加。
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| 关 键 词： | CoPtW 电沉积 沉积条件 |
| 文章编号： | 0258-7076(2004)01-0268-03 |
Effects of Process Conditions on Composition of Cobalt-Platinum-Tungsten Alloy Prepared by Electrical Deposition |
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| Cui Yujian ,Ge Hongliang,Huang Lihong,Zhou Hong,Han Yanbing,Liu Yapi.Effects of Process Conditions on Composition of Cobalt-Platinum-Tungsten Alloy Prepared by Electrical Deposition[J].Chinese Journal of Rare Metals,2004,28(1):268-270. |
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| Authors: | Cui Yujian Ge Hongliang Huang Lihong Zhou Hong Han Yanbing Liu Yapi |
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| Affiliation: | Cui Yujian *,Ge Hongliang,Huang Lihong,Zhou Hong,Han Yanbing,Liu Yapi |
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| Abstract: | A series of cobalt platinum tungsten alloys were deposited with sodium tungstate and cobaltous sulfate as the main salts and citrate as the complex agent. The effects of tungsten salt, complex agent, sodium ion, current density and temperature on alloy composition were studied. The results show that the tungsten content in cobalt platinum tungsten alloy increases with increasing concentration of tungsten salt, current density and temperature, and decreases with increasing complexing agent and cobalt, and platinum content decreases with increasing complexing agent. |
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| Keywords: | cobalt platinum tungsten electrodeposition deposit condition |
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