超精密切削单晶硅的刀具磨损机理

为了研究超精密切削单晶硅过程中金刚石刀具后刀面发生急剧磨损的机理,对单晶硅（111）晶面进行了超精密切削实验,并采用X射线光电子能谱分析仪对单晶硅已切削表面进行化学成分分析.实验结果表明：切削区域的高温高压导致金刚石刀具发生碳原子扩散磨损;切削过程中有碳化硅和类金刚石两种超硬微颗粒形成,而随着切削路程长度的逐渐增加,超硬微颗粒并不随之消失;碳化硅和类金刚石超硬微颗粒在金刚石刀具后刀面刻画和耕犁,从而产生沟槽磨损,直接导致金刚石刀具产生急剧磨损.

Tool Wear Mechanism Involved in Diamond Turning of Single Crystal Silicon

In order to find out the mechanism of heavy wear of flank face of diamond cutting tool involved in diamond turning of single crystal silicon,a large number of fly cutting tests were carried out on the crystalline plane(111) of single crystal silicon,and subsequently the X-ray photoelectron spectroscopy(XPS) technology was employed to detect the chemical components of the machined silicon surfaces.The experimental results indicate that the diffusion of carbon atoms of diamond cutting tool takes place due to ...