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Formation behavior of different topographies of crack growth path under high and low cyclic stresses in ultrafine-grained copper
Authors:M. Goto  K. KamilS.Z. Han  K. EuhY. Yokoho  S.S. Kim
Affiliation:a Department of Mechanical Engineering, Oita University, Oita 870-1192, Japan
b Structural Materials Division, Korea Institute of Materials Science, Changwon 642-831, Republic of Korea
c Department of Materials Science & Engineering, Gyeongsang National University, Chinju 660-701, Republic of Korea
Abstract:
Keywords:Copper   Ultrafine-grained microstructure   Fatigue   Shear bands   Grain coarsening
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