Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating

Mechanically induced Sn whiskers formed on Sn-2%Cu plated on Cu with Ni underplating were examined by scanning electron microscopy and electron backscatter diffraction. The results revealed that Sn grains became larger under mechanical stress due to recrystallization and/or grain growth. The notable feature was formation of many twin interfaces. Most twin boundaries were {301}, and there were approximately 20 times more {301} twin boundaries compared with the as-deposited plating. The analysis clearly revealed that many whiskers nucleated from newly formed {301} twinned grains, which formed on columnar grains. Thus, twin formation plays a critical role in mechanically induced formation of whiskers.