| 复合材料胶粘剂固化反应及工艺参数的研究 |
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| 引用本文： | 高家武.复合材料胶粘剂固化反应及工艺参数的研究[J].复合材料学报,1991,8(2):71-76. |
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| 作者姓名： | 高家武 |
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| 作者单位： | 北京航空航天大学 北京 |
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| 摘 要： | 本文用PERKIN-ELMER公司(简称P-E公司)的DSC-7仪器测定了SY—25胶膜的固化反应.根据DSC测试原理建立的动力学方程,通过DSC—7动力学软件,求出SY-25胶膜的固化反应动力学参数-固化反应表观活化能(Ea)、反应级数(n)以及表观频率因子(Z).利用已得到的动力学参数值,进一步预测SY-25胶膜的固化反应程度(α)、固化反应温度(Tc
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| 关 键 词： | 固化反应 动力学参数 |
| 收稿时间： | 1990-02-25 |
STUDY OF CURING REACTION AND TECHNOLOGY PARAMETERS OF COMPOSITE ADHESIVE |
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| Gao Jiawu.STUDY OF CURING REACTION AND TECHNOLOGY PARAMETERS OF COMPOSITE ADHESIVE[J].Acta Materiae Compositae Sinica,1991,8(2):71-76. |
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| Authors: | Gao Jiawu |
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| Affiliation: | Beijing University of Aeronautics and Astroaautics, Beijing, China |
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| Abstract: | The paper is about measuring curing reaction of SY-25 adhesive by usingDSC-7 of PERKIN-ELMER Company. Kinetic parameters of curing reaction of SY-25 adhesive such as curing reaction activation energy, reaction order and pro-exponential factor can be obtained based on the kinetic equation which is constructed in accordance with the measuring principle of DSC-7. Using the kinetic parameters, the relationship among degree of curing, curing tempera-ture and curing time is predicted.This work may be used to proviole a theore-tical data for making curing technology parameters of SY-25 adhesive. |
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| Keywords: | curing reaction kinetic parameter |
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