| 从全贴合技术发展分析触控面板市场发展趋势 |
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| 引用本文： | 孙红彪,段青鹏,赵乃辉. 从全贴合技术发展分析触控面板市场发展趋势[J]. 电子工业专用设备, 2013, 0(6): 45-49 |
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| 作者姓名： | 孙红彪 段青鹏 赵乃辉 |
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| 作者单位： | 中国电子科技集团公司第二研究所 |
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| 摘 要： | 全贴合即是以水胶或光学胶将面板与触摸屏以无缝隙的方式完全粘贴在一起,从全贴合技术方法入手,讲解了不同的贴合技术,通过分析、对比得出各种贴合技术的优缺点,并由此得出结论在所有投射式触控面板中,OGS为公认成本最低,且触控质量最好的技术,必将成为未来的主流触控技术。
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| 关 键 词： | 全贴合技术 触控面板 玻璃强度 |
Analysis of the Touch Panel Market Trends from the Full-fit Technology Development |
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| SUN Hongbiao,DUAN Qingpeng,ZHAO Naihui. Analysis of the Touch Panel Market Trends from the Full-fit Technology Development[J]. Equipment for Electronic Products Marufacturing, 2013, 0(6): 45-49 |
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| Authors: | SUN Hongbiao DUAN Qingpeng ZHAO Naihui |
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| Affiliation: | (The 2nd Research Institute of CETC,Taiyuan 030024,China) |
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| Abstract: | Full fit that is, water glue or optical plastic panel with touch screen seamless manner completely stuck together to OGS; This paper starts from the full fit technology method, explained the fit technology different, through the analysis of advantages and disadvantages, the comparison of different bonding technique that all sorts of joint technology, that in all the projection type touch panel, OGS is recognized the lowest cost, and the best quality, will become the mainstream of touch technology in the future. |
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| Keywords: | Full-fit technology Touch panel Strength of the glass |
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