小型化高集成宽带光收发组件

当前分立光子器件的体积和成本严重制约着微波光子技术在雷达系统中的应用。受限于当前的集成能力和材料体系，微波光子单片集成芯片短时间内难以实现工程应用。为满足雷达等应用场景对高集成微波光子器件的迫切需要，研制了一种新型小型化高集成光收发组件。该组件采用光电异构集成封装技术，将MZM调制器芯片、微波芯片、探测器芯片以及光环形器、波分复用器进行高度集成，单模块体积仅为85 mm×35 mm×10 mm，与传统MZM调制器体积相当。实验结果表明，其性能可与传统分立元器件相媲美。在6~18 GHz范围内，组件能够实现±1.5 dB的平坦度，上行能够实现18 dB以上的增益，下行能够实现?1 dB以上的增益，且链路噪声系数小于30 dB，平面化、小型化设计使其能够应用于相控阵雷达、电子战等多种应用场景，具有广阔的应用前景。

Miniaturized and highly integrated broadband optical transceiver assembly

At present, the volume and cost of discrete photonic devices severely restrict the application of microwave photonic technology in radar systems. Limited by the current integration capabilities and material systems, microwave photonic monolithic integrated chip is difficult to realize in a short time. Aiming at the urgent need for highly integrated microwave photonic devices in application scenarios such as radar, a new type of miniaturized and highly integrated broadband optical transceiver module was developed. The module adoped optoelectronic heterogeneous integrated packaging technology, which highly integrated MZM modulator chip, microwave chip, detector chip, optical circulator and wavelength division multiplexer. The size of a single module was only 85 mm×35 mm×10 mm, which was equivalent to the volume of a single MZM modulator. At the same time, its performance was comparable to the traditional discrete components. In the 6-18 GHz range, the component could achieve flatness of ±1.5 dB, gains of more than 18 dB in the uplink, and could achieve gains of more than ?1 dB in the downlink and the link noise figure was less than 30 dB. The planarization and miniaturization design makes it can be used in phased array radar, electronic warfare and other application scenarios, and it has broad application prospects.