树脂封装半导体元件去毛刺喷射磨塑料研究

以悬浮聚合法制备出不饱和聚酯树脂(UP)/Al2O3复合微粒作为喷射磨塑料,对比了其与日本磨塑料的粒径、密度、硬度、热变形温度等性能指标及其在实际应用中的打磨能力、磨损率及破碎率等指标。结果表明,自制的喷射磨塑料粒子的粒径、密度和打磨能力与日本生产的磨塑料相当,而硬度、热变形温度、磨损率和破碎回收率均优于日本产品。

RESEARCH ON ABRASIVE JET MEDIUM FOR DEBURRING ON RESIN ENCAPSULATED SEMICONDUCTOR COMPONENT

The compound particles of UP/Al2O3 were prepared by suspension polymerization and they were used as abrasive jet medium.The particle size,density,hardness,thermal deformation temperature and the sanding ability,wear rate and rate of decay in practice of the self-made abrasive material were compared with those of Japanese one.The results showed that the particle size,density and sanding ability of the self-made abrasive material were equivalent to those of Japanese one,but the hardness,HDT,wear rate and scrap rate of decay were better.