| 再流焊锡珠的形成与预防 |
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| 引用本文： | 王丽,蔡小洪.再流焊锡珠的形成与预防[J].电子质量,2002(8):U023-U024. |
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| 作者姓名： | 王丽 蔡小洪 |
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| 作者单位： | 珠海格力电器股份有限公司,广东,519070 |
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| 摘 要： | SMD表面贴装器件在再流焊接时常有锡珠产生，锡珠会导致线路短路、造成产品的质量隐患，本文详细分析锡珠产生的原因，并提出预防措施。
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| 关 键 词： | 表面贴装技术 再流焊接 焊膏 贴片 印刷电路板 |
The Formation and Prevention of the Soldering Balls at Reflow Soldering |
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| WangLi.Cai xiao-hong.The Formation and Prevention of the Soldering Balls at Reflow Soldering[J].Electronics Quality,2002(8):U023-U024. |
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| Authors: | WangLiCai xiao-hong |
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| Abstract: | There are always bring out soldering balls at reflow solding SMD. Solding balls can cause short circuit. And cause hidden troubles at products. Now I analyze the reasons of how corne into being the solding balls. And give suggestion to prevent the production of solding balls. |
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| Keywords: | SMT Reflow solding Soldering paste Chip components |
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