封装结构与材料导热系数对FC-BGA热性能的影响

应用计算流体动力学仿真技术对一种带金属散热盖的FC-BGA封装热性能作参数化研究,分析相关结构参数与材料导热系数对封装热性能的影响。研究中考虑的因子包括基板层数、导热树脂与金属散热盖粘合剂的导热系数、金属散热盖结构参数及基板导热系数。探讨了封装体中主要的热量传递途径及各途径上的热流量分配。

Influences of Package Structure and Material Thermal Conductivities on Thermal Performance of FC-BGA

Computational fluid dynamics(CFD) technology was applied on the thermal performance investigation by parameterized analysis for a thermal-enhanced FC-BGA package. The key structure parameters and material thermal conductivities had been discussed in regard to their impacts on the package thermal performance. The mainly concerned factors in this study including package substrate options, thermal conductivities for thermal grease and metal lid adhesive, metal lid structure and substrate thermal conductivity. The key heat transfer paths in the package body were disclosed and the percentage of heat flow at each path was also discussed.