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The corrosion behavior of Cu–Al and Cu–Al–Be shape-memory alloys in 0.5 M H2SO4 solution
Authors:HH Kuo  WH Wang  YF Hsu  CA Huang
Affiliation:aDepartment of Materials Science and Engineering, National Taiwan University, Taipei 107, Taiwan, ROC;bDepartment of Materials and Mineral Resources Engineering, National Taipei University of Technology, Taipei 106, Taiwan, ROC;cDepartment of Mechanical Engineering, Chang Gung University, Tao Yuan 333, Taiwan, ROC
Abstract:The corrosion behavior of Cu–Al and Cu–Al–Be (0.55–1.0 wt%) shape-memory alloys in 0.5 M H2SO4 solution at 25 °C was studied by means of anodic polarization, cyclic voltammetry, and alternative current impedance measurements. The results of anodic polarization test show that anodic dissolution rates of alloys decreased slightly with increasing the concentrations of aluminum or beryllium. Severe intergranular corrosion of Cu–Al alloy was observed after alternative current impedance measurement performed at the anodic potential of 0.6 V. However, the addition of a small amount of beryllium was effective to prevent the intergranular corrosion. The effect of beryllium addition on the prevention of intergranular corrosion is possibly attributed to the diffusion of beryllium atoms into grain boundaries, which in turn deactivates the grain boundaries.
Keywords:A  Copper  A  Aluminium  A  Alloy  C  Intergranular corrosion
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