The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad |
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Authors: | Shih-Chang Chang Sheng-Chih Lin Ker-Chang Hsieh |
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Affiliation: | (1) Institute of Materials Science and Engineering, Center for Nanoscience and Nanotechnology, National Sun Yat-Sen University, Kaohsiung, Taiwan 804, Republic of China |
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Abstract: | In this study, we used microstructure evolution and electron microprobe analysis (EPMA) to investigate the interfacial reactions
in Sn-Zn and Sn-Zn-Al solder balls with Au/Ni surface finish ball-grid-array (BGA) bond pad over a period of isothermal aging
at 150°C. During reflow, Au dissolved into the solder balls and reacted with Zn to form γ-Au3Zn7 and γ2-AuZn3. As aging progressed, γ and γ2 transformed into γ3-AuZn4. Finally, Zn precipitated out next to γ3-AuZn4. The Zn reacted with the Ni layer to form Ni5Zn21. A thin layer (Al, Au, Zn) intermetallic compound (IMC) formed at the interface of the Sn-Zn-Al solder balls, inhibiting
the reaction of Ni with Zn. Even after 50 days of aging, no Ni5Zn21 was observed. Instead, fine (Al, Au, Zn) particles similar to Al2 (Au, Zn) in composition formed and remained stable in the solder. The lower ball shear strength corresponded with the brittle
fracture morphology in Sn-Zn-Al solder ball samples. |
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Keywords: | Sn-Zn solder Sn-Zn-Al solder Au-Zn intermetallic compound Ni-Zn intermetallic compound reliability |
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