| 关于Cu-Au合金溅射机制的研究 |
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| 引用本文： | 王震遐,朱福英,陈文彪,曹德新,周祖尧,张衡山,张阿虎.关于Cu-Au合金溅射机制的研究[J].核技术,1986(1). |
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| 作者姓名： | 王震遐 朱福英 陈文彪 曹德新 周祖尧 张衡山 张阿虎 |
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| 作者单位： | 中国科学院上海原子核研究所
(王震遐，朱福英，陈文彪，曹德新)，中国科学院上海冶金研究所
(周祖尧)，上海半导体器件研究所
(张衡山)，上海半导体器件研究所(张阿虎) |
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| 摘 要： | 本文报道了用热中子活化法测量Cu-Au合金在80keV Ar~+离子不同剂量轰击下的部分溅射产额比S_Cu/S_Au,并用卢瑟福背散射(RBS)技术分析样品中元素的反冲以及表面层成分的相对变化,从而研究了元素择优溅射对表面层变化所起的作用。
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| 关 键 词： | 热中子活化 卢瑟福背散射 改变层 |
The study of ion sputtering mechanism on Cu-Au alloy |
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| Wang Zhenxia Zhu Fuying Chen Wenbiao Cao Dexin.The study of ion sputtering mechanism on Cu-Au alloy[J].Nuclear Techniques,1986(1). |
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| Authors: | Wang Zhenxia Zhu Fuying Chen Wenbiao Cao Dexin |
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| Abstract: | Dose dependence in preferential sputtering and altered surface layer of Cu-Au alloy has been studied by using thermal-neutron activation and Rutherford backscattering (RBS). The copper-gold sputtering atom ratio SCu/SAu decreases with increasing ion dose. The results of RBS measurement show that the recoil implantation of gold atoms raises with increasing ion dose. The fact suggests that the bombardment of Ar+ ions onto Cn-Au alloy films causes the preferential sputtering of Cu atoms resulting in the depletion of Au atoms in the outmost surface layer and the Au-rich beneath this layer. |
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| Keywords: | thermal-neutron activation Rutherford backscattering altered layer |
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