| 改性环氧树脂灌封材料的研制 |
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| 引用本文： | 王志政,周佑亮,黄世强.改性环氧树脂灌封材料的研制[J].化工新型材料,2009,37(12). |
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| 作者姓名： | 王志政 周佑亮 黄世强 |
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| 作者单位： | 1. 湖北大学功能材料绿色制备与应用省部共建教育部重点实验室,武汉,430062;海洋化工研究院,青岛,266071
2. 湖北大学功能材料绿色制备与应用省部共建教育部重点实验室,武汉,430062 |
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| 摘 要： | 用端羧基丁腈橡胶(CTBN)与环氧树脂AG-80反应制得改性环氧树脂(Ⅰ);以硅硼树脂与双酚A型环氧树脂反应得到改性环氧树脂(Ⅱ);将改性环氧树脂(Ⅰ)和(Ⅱ)按比例在室温下充分混匀为A组分,把固化剂、阻燃剂等混配成B组分,将A和B组分按不同配比均匀混合配成灌封材料,并以IR、拉力机等仪器分别对改性树脂、灌封材料进行结构及力学性能的测试表征.筛选出的最佳固化条件为,当A组分与B组分用量为25:1时,于80～100℃固化2～4h,可得到理想的灌封效果.
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| 关 键 词： | 端羧基丁腈橡胶 硅硼树脂 改性环氧树脂 灌封材料 |
Study on modified epoxy resin-encapsulating materials |
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| Wang Zhizheng,Zhou Youliang,Huang Shiqiang.Study on modified epoxy resin-encapsulating materials[J].New Chemical Materials,2009,37(12). |
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| Authors: | Wang Zhizheng Zhou Youliang Huang Shiqiang |
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| Abstract: | In the room temperature, a modified epoxy resin (Ⅰ) prepared from CTBN and epoxy resin AG-80 was mixed proportionately as component A, with the modified epoxy resin (Ⅱ) from the reaction between silicon-boron resin and bisphenol-A epoxy resin. And others such as curing agent, flame-retardant were mixed as component B. Then, A and B were mixed as encapsulating materials in different mixing weight ratio, and all the modified resins, encapsulating materi-als were characterized by IR and mechanical testing. The optimum condition was that a ideal encapsulating materials was obtained from the weight ratio of A and B for 25 : 1, curing temperature for 80～100℃, and curing time for 2～4h. |
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| Keywords: | CTBN silicon-boron resin modified epoxy resin encapsulating material |
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