In-house development of co-fireable thick film silver conductor for LTCC applications |
| |
| Authors: | Shweta Jagtap Varsha Deshpande Vivek Rane Sunit Rane Girish Phatak Dinesh Amalnerkar |
| |
| Affiliation: | (1) Thick Film Materials & Electronic Packaging Division, Centre for Materials for Electronics Technology, Panchawati, Off. Dr. Bhabha Road, Pune, 411008, India |
| |
| Abstract: | The rapidly growing wireless industry needs new high performance materials to build low loss, high density, and thermally stable integrated packages. Applications include automotive safety, control, global positioning system (GPS) mapping and entertainment, multifunctional portable phones, video and data transmission through wireless local area network (WLAN) etc. Recently, low temperature co-fired ceramics (LTCC) technology is referred as a key approach for smart packaging. Although its use has been initiated in the telecommunication field due to the excellent dielectric properties of the LTCC tapes, its application areas have been diversified recently. In the present work, the attempt has been made towards the development of thick film silver conductor composition compatible with available LTCC tapes (DuPont DP-951AX). The physical, microstructural, and electrical properties of the pastes prepared with different compositions are presented in this paper. |
| |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ |
|
