Cu diffusion along Al grain boundaries

Cu grain boundary diffusion (GBD) in Al was investigated by EPMA in temperature range from 300 to 400 °C.The triple product sδD_gb (s—segregation coefficient, δ—grain boundary width, D_gb—GBD coefficient) was calculated due to Fisher-Gibbs solution using two methods—measuring of GB concentration in dependence on penetration depth and the contour angle (at the top of diffusion wedge). In the first case ; in the second .