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聚酰亚胺薄膜热降解动力学研究
引用本文:李野,周浩然,赵双,郭翠,姜浩.聚酰亚胺薄膜热降解动力学研究[J].化学与粘合,2014(4):268-270.
作者姓名:李野  周浩然  赵双  郭翠  姜浩
作者单位:哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨150040
摘    要:聚酰亚胺薄膜是目前已经工业化的高分子材料中耐热性最好的品种,具有优越的综合性能。常规热老化应用已经成熟,但实验周期长。通过热重分析(TG)方法研究聚酰亚胺(PI)薄膜的热老化寿命。利用Popescu方法求出反应动力学机理函数,采用Ozawa法求得PI在空气氛围下的热分解活化能(E),同时计算出相应的碰撞系数(A),最后估算出其长期使用的上限温度。

关 键 词:聚酰亚胺  热重分析  热老化寿命  反应动力学

Study on the Thermal Degradation Kinetics of Polyimide Film
LI Ye,ZHOU Hao-ran,ZHAO Shuang,GUO Cui and JIANG Hao.Study on the Thermal Degradation Kinetics of Polyimide Film[J].Chemistry and Adhesion,2014(4):268-270.
Authors:LI Ye  ZHOU Hao-ran  ZHAO Shuang  GUO Cui and JIANG Hao
Affiliation:(College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China)
Abstract:The polyimide (PI) film has the best heat resistance among the industrialized polymer materials, and it also has excellent overall performance. The conventional thermal aging has been mature, but it requires a long experimental period. The thermal aging life of polyimide is studied by thermal gravimetric analysis. The kinetic mechanism function of PI is determined via Popescu method, the activation energy of thermal decomposition of PI in air atmosphere is obtained by Ozawa method. Meanwhile, the collision coefficient (A) is calculated; finally, its maximum working temperature for long-term application is estimated.
Keywords:Polyimide  thermal gravimetric analysis  thermal aging life  reaction kinetics
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