| 新型MEMS致冷器研究 |
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| 引用本文： | 刘少波.新型MEMS致冷器研究[J].电子工业专用设备,2004,33(1):21-25. |
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| 作者姓名： | 刘少波 |
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| 作者单位： | 中国科学院电工研究所微纳加工部,北京,100080 |
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| 摘 要： | 微机电系统(MEMS)与超大规模集成电路(ULIC)进一步微型化与集成化,急需微型冷却系统对其芯片等进行局部冷却。因此,基于硅微机械加工工艺的微型致冷器被提上研究日程,并有望发展成为无压缩机、无机械部件、低功耗的新型致冷器。着重介绍了微型MEMS致冷器的国内外研究动向与发展趋势,阐述并分析了几种典型致冷材料与器件的工作原理、技术可行性及应用前景。
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| 关 键 词： | 微型MEMS致冷器 pn结热电薄膜 铁电薄膜 电生热效应 Seeback效应 |
| 文章编号： | 1004-4507(2004)01-0021-05 |
| 修稿时间： | 2003年12月2日 |
Recent Research Progresses of MEMS Microcooler |
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| Liu Shao-bo.Recent Research Progresses of MEMS Microcooler[J].Equipment for Electronic Products Marufacturing,2004,33(1):21-25. |
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| Authors: | Liu Shao-bo |
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| Abstract: | Due to the farther micromation and integration of MEMS and ULIC, a micro-cryogenic system is in urgent need for the cryogenic refrigeration of their microchips. Thus the micro-cryogenic refrigeratory without compressor and mechanical parts, is put forward to study, which is based on the MEMS fabrication technique. The fundamentals, feasibility, prospect of this research field are briefly introduced in this paper. |
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| Keywords: | micro-MEMS cryogenic refrigeratory thermoelectric thin film ferroelectric thick film elec-trocaloric effect Seeback effect |
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