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射频磁控溅射SiOx薄膜的制备与阻隔性能研究
引用本文:董峰,高德,林晶,刘壮. 射频磁控溅射SiOx薄膜的制备与阻隔性能研究[J]. 包装工程, 2009, 30(6)
作者姓名:董峰  高德  林晶  刘壮
作者单位:哈尔滨商业大学,哈尔滨,150028;哈尔滨商业大学,哈尔滨,150028;哈尔滨商业大学,哈尔滨,150028;哈尔滨商业大学,哈尔滨,150028
基金项目:国家科技支撑重大项目,黑龙江省研究生创新基金 
摘    要:
利用磁控溅射技术,以SiO2为靶材,Ar为射频源气体,在PET基材上制备SiOx薄膜.研究了不同放电功率、氩气流量、镀膜时间等参数对SiOx薄膜阻隔性能的影响.结果表明:在一定范围内,薄膜的阻隔性能随放电功率的增大而增大,而后逐渐减小;氩气流量对薄膜的阻隔性能也有一定影响;镀膜时间在10min时SiOx薄膜的阻隔性能最好.扫描电镜SEM测试表明,在氩气流量为100cm3/min,镀膜时间10min,1500W放电功率下制备的SiOx薄膜阻隔性能较好、表面较均匀.

关 键 词:磁控溅射  SiOx薄膜  阻隔性能  透氧  透湿

Preparation of Silicon Dioxide Film by RF Magnetron Sputtering and Study of Its Barrier Performance
DONG Feng,GAO De,LIN Jing,LIU Zhuang. Preparation of Silicon Dioxide Film by RF Magnetron Sputtering and Study of Its Barrier Performance[J]. Packaging Engineering, 2009, 30(6)
Authors:DONG Feng  GAO De  LIN Jing  LIU Zhuang
Affiliation:DONG Feng,GAO De,LIN Jing,LIU Zhuang(Harbin University of Commerce,Harbin 150028,China)
Abstract:
Silicon dioxide films were prepared by magnetron sputtering on PET substrates with carrier gas Ar and silicon dioxide target.The influence of processing parameters on barrier properties was studied,of which were discharge power,argon gas flow and deposition time.The result showed that the barrier properties increased with the increasing discharge power,then decreased gradually;argon gas flow also plays a role in the barrier properties;the deposition time of the best barrier property was 10 minute.The SEM re...
Keywords:magnetron sputtering  silicon dioxide film  barrier properties  OTR  WVTR  
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