镁合金直接化学镀镍活化表面状态对镀速的影响 |
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引用本文: | 向阳辉,胡文彬,沈彬,赵昌正,丁文江.镁合金直接化学镀镍活化表面状态对镀速的影响[J].电镀与环保,2000,20(2):21-23. |
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作者姓名: | 向阳辉 胡文彬 沈彬 赵昌正 丁文江 |
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作者单位: | 上海交通大学金属基复合材料国家重点实验室,上海,200030 |
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摘 要: | 研究了镁合金直接化学镀镍活化后表面状态对镀速的影响,结果表明,活化后表面FO比值较小时,镀速较快。这种现象与氧化镁在镀液中的溶解造成较多的基底与镀液中镍离子的置换反应有关。
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关 键 词: | 化学镀 镁合金 活化 镀速 镀镍 电镀 |
修稿时间: | 1999-10-06 |
Effect of Surface State after Activation on Deposition Rate of Direct Electroless Nickle Plating on Magnesium Alloy |
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Abstract: | Effects of surface state after activation on deposition rate of direct electroless nickle plating on magnesium alloy are investigated. Reuslts show deposition rate is higher with lower F/O ratio of activated surface, which is related to magnesium oxide dissolution into plating bath and displacement reaction between substrate and nickle ions in bath. |
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Keywords: | Electroless nickle plating Magnesium alloy Activation Deposition rate |
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