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| 用于先进的双嵌入和栓工艺的低缺陷钨CMP高性价比浆料(英文) | |
| 作者姓名： | Tun-YanLo LIChung-Liu CHINHung-Chang SimonJ.Kirk PhilippeChelle AraiPeng |
| 作者单位： | [1]NanyaTechnologyCorp.,Taiwan [2]EKCTechnology（DuPontElectronicTechnologies）,CA,USA [3]WahLeeIndustrialCorp.,Hsinchu,Taiwan |
| 摘 要： | 介绍了用于钨双嵌入和钨栓CMP工艺的新型CMP3200TM氧化铝浆料,测试证明,这种浆料在110nm技术节点的钨CMP工艺应用中取得了理想的效果。通过对氧化铝粒子制造工艺的有效控制,获得了可满足110nm技术节点双嵌入和栓层钨CMP工艺要求的低缺陷率,高性价比的氧化铝蛐硝酸铁浆料。从而在价格竞争激烈的半导体制造领域,特别是代工市场引起了业界越来越多的关注。 |
| 关 键 词： | 钨双嵌入工艺 钨栓工艺 CMP浆料 高性价比 低缺陷率 110nm技术节点 |
A Cost Effective, Low-defect Tungsten CMP Slurry for Advanced Damascene and Plugs Processes |
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| Tun-YanLo LIChung-Liu CHINHung-Chang SimonJ.Kirk PhilippeChelle AraiPeng.A Cost Effective, Low-defect Tungsten CMP Slurry for Advanced Damascene and Plugs Processes[J].Equipment for Electronic Products Marufacturing,2004,33(6):16-21. | |
| Authors: | Tun-Yan Lo LI Chung-Liu CHIN Hung-Chang Simon JKirk Philippe Chelle Arai Peng |
| Affiliation: | 1. Nanya Technology Corp., Taiwan 2. EKC Technology (DuPont Electronic Technologies), CA, USA 3. WahLee Industrial Corp., Hsinchu, Taiwan |
| Abstract: | The new CMP3200TM alumina slurry which meets the 110nm technology node for tungsten CMP on damascene and plug layers has been introduced. The testing has shown it is a very low cost, low defectivity alumina/Ferric Nitrate slurry. |
| Keywords: | W Damascene Processes W Plugs Processes CMP Slurry Cost Effective Low Defectivity 110 nm Technology Node |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |