| 电镀铜薄膜界面结合强度及氧化性能的研究 |
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| 引用本文： | 余凤斌,朱德明,夏祥华.电镀铜薄膜界面结合强度及氧化性能的研究[J].绝缘材料,2009,42(1). |
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| 作者姓名： | 余凤斌 朱德明 夏祥华 |
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| 作者单位： | 山东天诺光电材料有限公司,济南,250101 |
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| 基金项目： | 国防基础科研项目，济南市科技攻关项目 |
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| 摘 要： | 镀层与基体的结合强度是衡量镀层与基体表面结合牢固程度的重要指标,也是其各项性能得以实现的重要前提.采用电镀方法在PI膜上制备了铜(Cu)薄膜,并研究了工艺参数与结合强度的关系.同时,依据Cu薄膜方块电阻随氧化时间的变化情况,得到氧化产物厚度与氧化时间的关系.结果表明:镀层结合强度随着电流密度、温度及pH值的增大均先增加而后逐步减小.在低温下铜薄膜的氧化符合指数规律,高温下符合线性规律,温度越高,铜的氧化速率越快.
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| 关 键 词： | 电镀 结合强度 氧化 |
Research on Interface Bonding Strength of Copper Electroplating Film and Oxidation Performance |
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| YU Feng-bin,ZHU De-ming,XIA Xiang-hua.Research on Interface Bonding Strength of Copper Electroplating Film and Oxidation Performance[J].Insulating Materials,2009,42(1). |
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| Authors: | YU Feng-bin ZHU De-ming XIA Xiang-hua |
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| Affiliation: | Shandong Tiannuo Photoelectric Material Co.;Ltd;Jinan 250101;China |
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| Abstract: | The binding force between coatings and matrix is an important index that characterizes the firm degree between coating and matrix surface,and it is also an important premise to achieve other performances.An electroplating method was developed to prepare copper films on PI films,and the relations between technical parameters and combination strength were studied.The relation between the thickness of oxidation products and oxidation time was obtained by analyzing the changes of copper films sheet resistance w... |
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| Keywords: | electroplating bonding strength oxidation |
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