环氧树脂/微胶囊红磷电子电气封装材料的研制

以环氧树脂为基体、微胶囊红磷为阻燃剂，研制了电子电气封装材料，研究了微胶囊红磷含量对材料阻燃性能、力学性能及抑烟性能的影响。当加入10份微胶囊红磷时可使材料的阻燃性能达到UL94V-0级，氧指数从19．5％提高到28．2％；微胶囊红磷的添加量在一定的范围内对材料的力学性能影响很小，当添加量增至14份时，材料的拉伸强度略有下降，从48．84MPa下降至46．92MPa，弯曲强度先略有提高而后有所降低，而冲击强度从9．29kJ／m^2提高到10．28kJ／m^2；微胶囊红磷与硼酸锌的复配体系具有很好的抑烟性能。

DEVELOPMENT OF EPOXY RESIN/MICROENCAPLIZED RED PHOSPHORUS ELECTRONIC AND ELECTRICAL PACKAGING MATERIALS

The electronic and electrical packaging materials were developed with epoxy resin as matrix and microencaplized red phosphorus as flame retardant. The influence of the content of microencaplized red phosphorus on the flame retardancy, the mechanical properties and the smoke suppression were studied. The results show that the material can be flame-retarded with the 10phr loading of microencaplied red phosphorus and reach to the level of UL 94 V - 0 and 28. 2% , that the microencaplied red phosphorus has small effect on the mechanical properties within a certain extent of the loading, with the tensile strength value being from 48. 84 MPa to 46. 92 MPa with the loading from 0 to 14 phr, the impact strength value being from 9. 29 kJ/m2 to 10. 28 kJ/m2, the flex strength value being from 130. 2 MPa to 136. 6 MPa, and that the composite system of microencaplied red phosphorus and zinc biorate has good smoke suppression.