Shear strength and aging characteristics of 63Sn?37Pb solder bumps with various solder ball and pad sizes |
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Authors: | Choi Jin-Won Cha Ho-Seob Oh Tae-Sung |
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Affiliation: | (1) Department of Materials Science and Engineering, Hong-Ik University, 72-1 Sangsu-dong, Mapo-gu, 121-791 Seoul, Korea |
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Abstract: | The shear strength and aging characteristics of 63Sn–37Pb solder bumps were characterized with variation in solder ball and
UBM pad sizes. The shear strength increased with shorter effective crack size,a
effs
which was determined with the solder ball and pad sizes. The shear strength of the solder bumps on Au/Ni/Cu and Ni/Cu did
not change significantly with reflow time. Substantial decrease in the shear strength occurred for the solder bumps formed
on Au/Ni/Cu with aging treatment, and the shear strength after aging was also related to the bump shape which was determined
with the solder ball and pad sizes. |
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Keywords: | solder Sn− Pb shear strength aging electronic packaging |
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