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基于板级电路加速退化数据的可靠性分析
引用本文:王玉明,蔡金燕. 基于板级电路加速退化数据的可靠性分析[J]. 电子产品可靠性与环境试验, 2009, 27(1): 9-12
作者姓名:王玉明  蔡金燕
作者单位:军械工程学院光学与电子工程系,河北,石家庄,050003
摘    要:
基于板级电路加速性能退化数据来研究电子产品可靠性评估问题。对电源整板进行80℃、100℃、120℃下加速退化试验.监测到输出电压随温度变化的退化过程。由试验数据对加速性予以定量验证,并基于Weibull分布采用最小二乘法进行可靠性统计推断。

关 键 词:加速试验  性能退化  可靠性

Reliability Analysis Based on Circuit Board Accelerated Degradation Data
WANG Yu-ming,CAI Jin-yan. Reliability Analysis Based on Circuit Board Accelerated Degradation Data[J]. Electronic Product Reliability and Environmental Testing, 2009, 27(1): 9-12
Authors:WANG Yu-ming  CAI Jin-yan
Affiliation:Ordnance Engineering College;Shijiazhuang 050003;China
Abstract:
Reliability assessment based on circuit board accelerated degradation data are studied. In accelerated degradation test is conducted on power supply boards under 80 ℃, 100 ℃ and 120 ℃. The degradating of the output voltage as a function of the temperature are observed. The acceleration of the test are quantitatively validated based on the test data, and the statistical inferences are obtained using the least square estimation based on weibull distribution.
Keywords:accelerated test  performance degradation  reliability  
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