| Abstract: | A 1.9‐GHz single‐stage differential stacked‐FET power amplifier with uniformly distributed voltage stresses was implemented using 0.32‐μm 2.8‐V thick‐oxide MOSFETs in a 0.18‐μm silicon‐on‐insulator CMOS process. The input cross‐coupled stacked‐FET topology was proposed to evenly distribute the voltage stresses among the stacked transistors, alleviating the breakdown and reliability issues of the stacked‐FET power amplifier in sub‐micrometer CMOS technology. With a 4‐V supply voltage, the proposed power amplifier with an integrated output coupled‐resonator balun showed a small‐signal gain of 17 dB, a saturated output power of 26.1 dBm, and a maximum power‐added efficiency of 41.5% at the operating frequency. Copyright © 2017 John Wiley & Sons, Ltd. |
