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| 多层陶瓷电容器的发展及其动向 | |
| 引用本文： | 薛泉林. 多层陶瓷电容器的发展及其动向[J]. 电子元件与材料, 1996, 15(5): 10-14 |
| 作者姓名： | 薛泉林 |
| 作者单位： | 电子工业部第七研究所 |
| 摘 要： | 小型、低压、大容量化，片式高压系列化和低成本化是当前多层陶瓷电容器的主要技术发展趋势；移动通信设备和开关电源等产品是其应用的热门。瓷膜材料的面世，符合多层陶瓷电容器的低成本、小型和大容量化的发展潮流，将会取得推广与应用。 |
| 关 键 词： | 多层陶瓷电容器 发展动向 瓷膜材料 |
Development Trends of Multilayer Ceramic Capacitors |
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| Xue Quanlin. Development Trends of Multilayer Ceramic Capacitors[J]. Electronic Components & Materials, 1996, 15(5): 10-14 | |
| Authors: | Xue Quanlin |
| Affiliation: | Xue Quanlin |
| Abstract: | Recent development trends of multilayer ceramic capacitors are miniaturisation, lower vol tage,larger capacitance, lower production cost and formation of HV MLCC series. The products used for mobile communication and switching power supply are in great demand. Appearance of thin ceramic film promotes development trends of miniaturisation, lower production cost and larger capacitance of multilayer ceramic capacitors. It is expected that the thin ceramic film will obtain application and dissemination. |
| Keywords: | multilayer ceramic capacitors development tend thin ceramic film |
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