CSP热轧过程中夹杂物周围孔洞的演变

借助于动态显式有限元软件ABAQUS/Explicit,模拟了CSP热轧过程中,板坯厚度方向上不同位置处直径为50μm的Al2O3夹杂物周围孔洞的形成和演变过程。结果表明,对于不同位置处的Al2O3夹杂物,在它们沿轧制方向的前、后部位都形成了孔洞,但前孔洞面积大于后孔洞面积;夹杂物越靠近板坯表面,形成的孔洞越大;热轧过程中,孔洞的演变是一个"愈合—长大—愈合"的动态过程;随着道次的增加,夹杂物前、后孔洞在轧制方向上的投影长度变化与面积变化趋势相一致,而与孔洞尖端夹角的变化趋势恰好相反;孔洞在热轧过程中发生转动,导致前孔洞尖端朝着带钢表面扩展。模拟结果有助于揭示夹杂物周围孔洞与表面缺陷的关系,并为实际生产提供理论指导。

Evolution of voids around inclusions during CSP hot rolling process

With the aid of dynamic explicit FE package ABAQUS/Explicit, void formation and evolution around 50??m Al2O3 inclusions with different positions along thickness direction inside slab during CSP hot rolling process were simulated. The results show that voids are formed in the front and rear of inclusions with different positions, but front void area is larger than rear void area. The smaller the distance from inclusions to slab surface, the larger area of voids. Void evolution is a dynamic procedure with the feature of ??closure-growth-closure??. With the pass increasing, the changing trend of void projected length is coincident with void area, but contrary to the branch angle at void cusp. The rotation of voids leads to a growth of front void cusp towards steel strip surface. The simulation results are conducive to reveal the relationship between voids and surface defect, and will provide theoretical guidance for actual production.