| 采用等离子干燥工艺提高镀膜附着强度稳定性 |
| |
| 引用本文： | 詹为宇.采用等离子干燥工艺提高镀膜附着强度稳定性[J].电讯技术,2016,56(3):342-345. |
| |
| 作者姓名： | 詹为宇 |
| |
| 作者单位： | 中国西南电子技术研究所,成都,610036 |
| |
| 摘 要： | 镀膜工艺设计应能有效脱附物理和化学吸附，才能保证附着强度工艺稳定性。设备运行后腔室内表面沉积物增加，通过分析变化影响探索出一种等离子干燥工艺方法，应用后提高了生产效率，保证了薄膜电路金属叠层间附着强度生产稳定性，满足产品工程应用的可靠性要求。
|
| 关 键 词： | 毫米波组件 薄膜电路 附着强度 等离子干燥 溅射 材料出气 |
Improving adhesion stability of thin film with plasma drying technology |
| |
| ZHAN Weiyu.Improving adhesion stability of thin film with plasma drying technology[J].Telecommunication Engineering,2016,56(3):342-345. |
| |
| Authors: | ZHAN Weiyu |
| |
| Abstract: | The technical design of thin film plating should desorb the physical and chemical adsorption for stability of adhesion.The equipment vacuum cavity internal face is changed with deposit formation after operation.A method with plasma drying to clear depositing is investigated after analyzing this influence.Application of the method in the thin film plating has raised the productivity effciency,ensured the stability of adhesion between metal platings,and satisfied the reliability requirement of engineering applications. |
| |
| Keywords: | millimeter wave module thin film circuit adhesion of metallic coatings plasma drying sputte-ring breathing of material |
| 本文献已被 万方数据 等数据库收录！ |
| 点击此处可从《电讯技术》浏览原始摘要信息 |
|
点击此处可从《电讯技术》下载全文 |
