Interfacial reactions in the Sb–Sn/(Cu,Ni) systems: Wetting experiments |
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| Authors: | R Novakovic T Lanata S Delsante G Borzone |
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| Affiliation: | 1. National Research Council (CNR) – Institute for Energetics and Interphases (IENI), Via De Marini, 6-16149 Genoa, (Italy);2. DCCI-University of Genoa, Via Dodecaneso, 31 – 16146-Genoa, (Italy) |
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| Abstract: | Interfacial reactions in the Sb–Sn/Cu and Sb–Sn/Ni systems have been investigated by means of wetting experiments. The wetting behaviour of two lead-free alloys, namely, Sb2.5Sn97.5 and Sb14.5Sn85.5 (at.%), in contact with Cu and Ni-substrates has been studied in view of possible applications as high-temperature solders in the electronics industry. The contact angle measurements on Cu and Ni plates were performed by using a sessile drop apparatus. The solder/substrate interface was characterised by the SEM-EDS analyses. |
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| Keywords: | Alloys Interfaces Metals Solidification Electron microscopy |
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