| 树脂塞孔工艺技术的研发 |
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| 引用本文： | 赵志平,周刚.树脂塞孔工艺技术的研发[J].印制电路信息,2010(2):31-34,52. |
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| 作者姓名： | 赵志平 周刚 |
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| 作者单位： | 惠州中京电子科技股份有限公司,广东,惠州,516008 |
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| 摘 要： | 文章概述了树脂塞孔后直接进行压合的工艺流程和主要工艺参数，通过实验对树脂塞孔范围进行评估与界定。通过研究开发树脂塞孔工艺，拓展了公司的产品范围和结构，提升了工艺制造水平。
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| 关 键 词： | 树脂塞孔 饱满度 气泡控制 范围界定 |
Research in Resin Plug-Hole Process Technology |
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| ZHAO Zhi-ping,ZHOU Gang.Research in Resin Plug-Hole Process Technology[J].Printed Circuit Information,2010(2):31-34,52. |
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| Authors: | ZHAO Zhi-ping ZHOU Gang |
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| Affiliation: | ZHAO Zhi-ping, ZHOU Gang |
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| Abstract: | This paper summarizes the post-resin plug holes directly Pressing the process and the main process parameters, through the experiment to define the scope of resin plug holes (only a first-order laser-blind buried holes). Resin plug holes through research and development process, expanding the company's product range and structure of the enhanced technology and manufacturing standards. |
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| Keywords: | resin plug hole plumpness bubble control scoping |
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